10-12 September 2014 



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Cloud Computing and Emerging Technologies for Mechatronic and Embedded Systems


Objectives: Cloud computing is defined as a pool of virtualized computing resources. Based on this virtualization, the cloud computing paradigm allows workloads to be deployed across physical machines via virtual resources. A cloud computing platform supports redundant, self-recovering, and scalable programming models that allow workloads to recover from many inevitable hardware/software failures. In a mechatronic and embedded cloud computing platform, software is migrating from an embedded system into a network, providing users with an anytime, anywhere access to programs and data on the mechatronic or embedded systems. The goal of this symposium is to provide a forum for researchers to discuss all aspects of cloud computing targeted to mechatronic and embedded systems. Listed below are, but not limited to, topics of interest for this symposium.


Scalable, Self-managing and Autonomic Cloud Computing platforms

• Dynamic instantiation
• Scaling platforms
• Dynamic composition
• Self-managing platforms
• Dynamic configuration
• Dynamic reconfiguration of services


Security of Cloud Computing Platforms

• Authentication; - Self-protecting platforms
• Resilience against Cyber attacks on Software as a Service (SaaS)
• Resilience against Cyber attacks on Platforms as a Service (PaaS)
• Resilience against Cyber attacks of Infrastructure as a Service (IaaS)


Cloud Computing Infrastructure

• Operating systems
• Control services
• Distributed infrastructure
• Distributed composite services


Cloud Computing Applications

• E-Commerce
• Media processing and Streaming search engines
• Web hosting
• Application hosting
• Collaboration tools;
• Store and share;
• Social networking for businesses and web applications;
• Bio-informatics;
• Biomedical applications MESA


Organizer’s Contact Information:


Prof. Yu-Cheng Chou

Department of Mechanical Engineering
Chung Yuan Christian University, Taiwan

The 10th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications
Sponsor: IEEE Intelligent Transportation Systems Society
Technical Co-Sponsors: ASME Division of Design Engineering
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